Laser cutting machine RM-LD-Ultra-100

for glasswaferfor the semiconductor industry

Romic Quartz Wafer Laser Cutting Machine is equipped with a non-diffractive precision optical system and femtosecond cold processing technology, capable of stably cutting quartz wafers into 3225, 1210, and 1008 dies. Compared to conventional blade dicing, this method completely eliminates defects such as chipping, micro-cracks, and wafer cracking. It significantly increases the cutting speed, thereby effectively improving both output rate and mass production yield, and significantly reducing the overall manufacturing cost of precision processing for ultra-thin quartz wafers. Workpiece Ultra-thin quartz wafer Applicable industry Electronic component Ideal for ultra-thin wafer As thin as 25um Self-developed Core Module Coaxial non-diffractive optical module Process Upgrade Output rate improved by 25% Overcoming Bottlenecks Overcome the bottleneck issues in conventional cutter wheel cutting of ultra-thin wafers. High Cutting Accuracy Self-developed core cutting algorithm ensures cutting accuracy (±1.5um). High Stability High-stability and reliable wafer transport system. Upgradable Capability This equipment can be upgraded to cut transparent and brittle materials such as sapphire and glass.