Optical inspection machine BM311B

for semiconductorsfor the electronics industrydefect

BM311B Hybrid AOI Machine is mainly applied to the appearance inspection of power semiconductor modules, IPMs, substrates and AMB products, and makes it possible to measure the dimensions of die, wire, bond, DBC, Pin and detect their defects Fast and accurate Win customer recognition for outstanding detection performance and reliable automation integration For the core needs of power module packaging customers regarding product surface quality during the production process, we have launched process inspection AOI machine. Leveraging the differentiated technological advantages of AI + conventional algorithms and AI-assisted programming, it ensures a miss rate of 0%, helping customers strictly control surface quality risks throughout the entire production process, thereby steadily improving product yield and market reputation. Strong compatibility Support the defect detection of IGBTs, IPMs, substrates and AMB products High efficiency Up to 600UPH for 40∗40mm^2 substrate inspection Excellent accuracy 2D and 3D detection and measurement accuracy reaches ±5μm@3σ Easy to use AI-based auto generation of inspection areas makes recipe creation a lot easier