Epoxy die bonder BM312A

fully-automaticfor the semiconductor industry

BM312A Automatic Epoxy Die Bonder is a highly stable and precise equipment which can serve as a fast and efficient die bonding solution for integrated circuits (including the consumer electronics and automotive electronics). High-end and cost-effective substitute Fill the gap of high-end die bonder in the domestic market and meet the requirement of end users for high production efficiency and great product consistency Targeting conventional semiconductor IC packaging customers, our Automatic Epoxy Die Bonder BM312A boasts high accuracy, high efficiency, high reliability, and high flexibility.This machine is specifically designed for mid-to-high-end IC packaging, and is ideal for 12" wafers and large-sized and high-density leadframes. The die placement accuracy is ±25μm, and the epoxy placement accuracy is ±5μm, ensuring packaging quality and stability. The linear motor drive and intelligent vision algorithms enable millisecond-level response and real-time temperature drift compensation, significantly increasing production efficiency to 20K pcs per hour.Additionally, the modular design and active vibration suppression technology ensure long-term reliability and ease of maintenance, meeting customers' diverse needs for high quality, high capacity, and low maintenance costs. High output UPH up to 20K Strong compatibility Suitable for 12 inch and smaller wafer and multiple frames Outstanding reliability Equipped with Poka-yoke function before loading, inline measurement and auto compensation of dispensed volume, inline inspection and correction of die position after bonding