Water spray cleaning machine LAC200

automaticfor wafersprocess

LAC200 is an economical 8" wafer cleaning machine designed to clean wafers cut with a dicing saw. Leveraging the atomizing system, the cleaner can generate high-pressure mist droplets to hit and clean the workpiece surface and the dicing street. Compact and neat Economical cleaner, small footprint, low energy consumption and outstanding cleaning effect/performance. LAC200 is an 8" wafer clean cleaner designed to clean up to 8" wafers cut with a dicing saw. Leveraging the atomizing system, the cleaner can generate high-pressure mist droplets to clean the workpiece surface and the dicing street. It is used in conjunction with an automatic dicing saw for the cleaning and drying process after dicing. High efficiency Small footprint, high efficiency, low noise Strong compatibility Support 3~8 inch wafers Up to 250*250mm square workpieces Easy operation Provide several cleaning modes with quick switchover feature