Silicon polishing machine FTB150MP

for wafersindustrial

The FTB150MP is a 6-inch CMP Tool designed for laboratory applications based on customer needs. It is compatible with various materials and features high-performance polishing units to achieve ultra-high wafer surface flatness. With its high cost-effectiveness, it serves as an ideal laboratory solution for high-precision process requirements. Wafer Size ≤6 inches Wafer Material Si, SiC, GaN, etc. Exquisite and compact with all functionalities Dedicated to core R&D and applications in small-size fields Compact Size Highly integrated single-head single-plate design. Flexible Process Integration High-rigidity structure allows for the application of greater pressure, may be equipped with diamond pad conditioner or nylon brush pad conditioner. Cost-Effectiveness Cost-effective laboratory solutions.