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... ·Throughput: 600pcs/batch,14400pcs/h(210mm wafer)；720pcs/batch,17280pcs/h(182mm wafer); ·Process bath circulation volume adjustable; ·Uniform pyramids texture,etch depth adjustable; · Wafer thickness ...
Working width: 5 mm - 200 mm
... It is mainly used for double-sided lapping and polishing of metal, non-metal, sapphire, and semiconductor materials, with air bag pressure and disc cooling function ...
... These series machines are two-axis high-precision single side polishing machines, the polishing head can rotate, swing and work in the high-pressure and high-speed condition, can polish ...
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