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Working width: 5 mm - 200 mm
... It is mainly used for double-sided lapping and polishing of metal, non-metal, sapphire, and semiconductor materials, with air bag pressure and disc cooling function ...
... These series machines are two-axis high-precision single side polishing machines, the polishing head can rotate, swing and work in the high-pressure and high-speed condition, can polish ...
... GBIR, SFQR). Wafer Size ≤12 inches GBIR ＜100nm Load&Unload Dry in wet out High-end domestic substitute of choice Reliability and stability-driven high-end domestic substitute High Throughput Equipped ...
Wuxi Autowell Technology Company
... features proprietary innovative technology, high-performance polishing units, and compatibility with both 8-inch and 12-inch wafers. It supports various materials and achieves ultra-high wafer surface ...
Wuxi Autowell Technology Company
... high-performance polishing units and integrates advanced combined cleaning technology, delivering superior cleaning results. It enables nanometer-level global planarization of substrates, meeting the requirements of advanced ...
Wuxi Autowell Technology Company
... features high-performance polishing units to achieve ultra-high wafer surface flatness. With its high cost-effectiveness, it serves as an ideal laboratory solution for high-precision process requirements. Wafer ...
Wuxi Autowell Technology Company
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