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Diameter: 150, 202 mm
... Product Introduction
Mainly used for chamfering and
grinding of silicon
wafers of various sizes. Groove shapes and quantities are designed to customer requirements, ensuring stable profile retention, long service ...
Qingdao Gaoce Technology Co., Ltd.
Diameter: 150, 202 mm
... Product Introduction
Mainly used for chamfering and
grinding of silicon carbide
wafers. Groove shape and quantity can be designed to customer requirements. Good shape retention, long service life and no defects ...
Qingdao Gaoce Technology Co., Ltd.
Diameter: 304, 380 mm
... sapphire thinning grinding wheel is designed for precision thinning and surface grinding of sapphire substrates. Wheel geometry can be customized to process various substrate sizes and ...
Qingdao Gaoce Technology Co., Ltd.
Diameter: 202 mm
... Great quality & longer life of edge grinding diamond wheels for semiconductor wafers (Silicon/SiC/GaN and others) *Work materials: Semiconductor wafers (Silicon/SiC/GaN and others) *Application: ...
Tokyo Diamond Tools Mfg. Co., Ltd.
Diameter: max 350.0 µm
... Diamond grinding wheel for coarse & fine grinding of SiC wafers in longer life with reasonable cost. *Work materials: Semiconductor wafer (SiC, GaN, GaAs, LT/LN) ...
Tokyo Diamond Tools Mfg. Co., Ltd.
... Notch wheel for semiconductor wafers Metal bond notch wheel for semiconductor wafers *Work materials: Semiconductor wafers(Silicon, SiC, GaAs, Sapphir etc)e *Application: ...
Tokyo Diamond Tools Mfg. Co., Ltd.
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