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Diameter: 150, 202 mm
... Grinding Wheels for Chamfering & Grinding of Semiconductor Wafer It is mainly used in chamfering & grinding for silicon wafers and silicon carbide ...
Diameter: 202 mm
... Great quality & longer life of edge grinding diamond wheels for semiconductor wafers (Silicon/SiC/GaN and others) *Work materials: Semiconductor wafers (Silicon/SiC/GaN and others) *Application: ...
Tokyo Diamond Tools Mfg. Co., Ltd.
Diameter: max 350.0 µm
... Diamond grinding wheel for coarse & fine grinding of SiC wafers in longer life with reasonable cost. *Work materials: Semiconductor wafer (SiC, GaN, GaAs, LT/LN) ...
Tokyo Diamond Tools Mfg. Co., Ltd.
... Notch wheel for semiconductor wafers Metal bond notch wheel for semiconductor wafers *Work materials: Semiconductor wafers(Silicon, SiC, GaAs, Sapphir etc)e *Application: ...
Tokyo Diamond Tools Mfg. Co., Ltd.
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