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Surfacing wheel cylindricalfor wafers
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Characteristics
- Function
- grinding
- Type
- cylindrical
- Application
- for wafers
- Diameter
150 mm, 202 mm
(5.91 in, 7.95 in)
Description
Product Introduction
Mainly used for chamfering and grinding of silicon wafers of various sizes. Groove shapes and quantities are designed to customer requirements, ensuring stable profile retention, long service life and processing without workpiece defects.
Product Parameters
Shape code | Diameter, D (mm) | Thickness, T (mm) | Aperture, H (mm) | Grooved, G
1A1V | 150 | 10 | 30 | Customized as required
9A1V | 202 | 20 | 30 | Customized as required
Features / Technical specifications
Mainly used for chamfering and grinding of silicon wafers of various sizes. Groove shapes and quantities are designed to customer requirements, ensuring stable profile retention, long service life and processing without workpiece defects.
Product Parameters
Shape code | Diameter, D (mm) | Thickness, T (mm) | Aperture, H (mm) | Grooved, G
1A1V | 150 | 10 | 30 | Customized as required
9A1V | 202 | 20 | 30 | Customized as required
Features / Technical specifications
- Application: Chamfering and grinding of semiconductor (silicon) wafers
- Available shape codes: 1A1V, 9A1V
- Typical dimensions (mm): D (150 / 202), T (10 / 20), H (30)
- Groove shapes and quantities: customizable to customer requirements
- Key properties: stable shape retention, long service life, no defects on processed workpieces
Other Qingdao Gaoce Technology Co., Ltd. products
Semiconductor Cutting Consumables
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.