Surfacing wheel A1V series

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Product Introduction
Mainly used for chamfering and grinding of silicon wafers of various sizes. Groove shapes and quantities are designed to customer requirements, ensuring stable profile retention, long service life and processing without workpiece defects.

Product Parameters
Shape code | Diameter, D (mm) | Thickness, T (mm) | Aperture, H (mm) | Grooved, G
1A1V | 150 | 10 | 30 | Customized as required
9A1V | 202 | 20 | 30 | Customized as required

Features / Technical specifications

• Application: Chamfering and grinding of semiconductor (silicon) wafers
• Available shape codes: 1A1V, 9A1V
• Typical dimensions (mm): D (150 / 202), T (10 / 20), H (30)
• Groove shapes and quantities: customizable to customer requirements
• Key properties: stable shape retention, long service life, no defects on processed workpieces