Surfacing wheel

cylindrical

Product description
Cylindrical grinding wheels, shape code 1A1, designed for cylindrical grinding of semiconductor silicon ingots (silicon rods). Suitable for high-speed industrial machining with efficient material removal and consistent dimensional accuracy. Typical applications include preparation and sizing of silicon ingots for semiconductor manufacturing.

Product parameters (mm)
Shape code | Diameter, D (mm) | Thickness, T (mm) | Aperture, H (mm) | Grit
1A1 | 350 | 35~100 | 127 | 100#~600#
1A1 | 400 | 50~150 | 203 | 100#~600#

Technical features / specifications

• Primary use: Cylindrical grinding of semiconductor silicon ingots (silicon rods)
• Operating attributes: high speed, efficient material removal, accurate machining
• Material removal capability: configured for effective stock removal while maintaining dimensional tolerance
• Durability: long service life suitable for continuous production
• Available specifications: see table above for Diameter (D), Thickness (T), Aperture (H) and Grit options