Edge grinding grinding wheel

bevelingcylindricalmetal-bonded diamond

Great quality & longer life of edge grinding diamond wheels for semiconductor wafers (Silicon/SiC/GaN and others) *Work materials: Semiconductor wafers (Silicon/SiC/GaN and others) *Application: Edge grinding/beveling [Specifications] *Grain size : #400 - #3000 *Outer diameter : Up to 202D *Internal diameter tolerance: H6 (Please consult with us for other tolerances.) *Dynamic balance: ≧0.1 g @Min. *Groove shape tolerance : ≧ 0.5 degrees *Number of grooves: Up to 10 grooves (more than 10 grooves are possible depending on groove shape.) Diamond with unique abrasive grain control is used to reduce the incidence of chipping and the machining damage. The use of a bond with excellent abrasion resistance ensures high dimensional stability of the wheel shape and long life. By improving the geometric accuracy of the wheel and developing a metal bond optimized for compound semiconductor wafers, we were able to obtain the test result that the wheel life in the SiC wafer edge grinding process increased by more than 30% compared to other manufacturers' products.