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Surfacing wheel 1A1Vbevelingcylindricalfor wafers
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Characteristics
- Function
- grinding, beveling
- Type
- cylindrical
- Application
- for wafers
- Diameter
150 mm, 202 mm
(5.91 in, 7.95 in)
Description
Product Introduction
Mainly used for chamfering and grinding of silicon carbide wafers. Groove shape and quantity can be designed to customer requirements. Good shape retention, long service life and no defects on the processed workpiece.
Product Parameters
Shape code | Conventional specification (mm) | D (mm) | T (mm) | H (mm) | Grooves (G)
1A1V | 150 | 10 | 30 | Designed as required
9A1V | 202 | 20 | 30 | Designed as required
Characteristics / Technical specifications
Mainly used for chamfering and grinding of silicon carbide wafers. Groove shape and quantity can be designed to customer requirements. Good shape retention, long service life and no defects on the processed workpiece.
Product Parameters
Shape code | Conventional specification (mm) | D (mm) | T (mm) | H (mm) | Grooves (G)
1A1V | 150 | 10 | 30 | Designed as required
9A1V | 202 | 20 | 30 | Designed as required
Characteristics / Technical specifications
- Application: Chamfering and grinding of silicon carbide wafers
- Groove shape and quantity: designed to customer requirements
- Good shape retention
- Long service life
- No defects on processed workpieces
- Available shape codes: 1A1V, 9A1V
- Example dimensions: 1A1V — D 150 mm, T 10 mm, H 30 mm; 9A1V — D 202 mm, T 20 mm, H 30 mm
Other Qingdao Gaoce Technology Co., Ltd. products
Silicon Carbide Cutting Consumables
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.