Silicon diamond wire

Product Description
Diamond wire developed specifically for silicon carbide slicing. Engineered for stable operation with reduced wire breakage and uniform abrasive distribution. The wire is produced under high-definition monitoring for process traceability and undergoes a special treatment to improve toughness and abrasion resistance.

Key Features

• Designed specifically for silicon carbide slicing to match material characteristics
• Automatic control system minimizes fluctuations in abrasive (sand) volume
• Uniform abrasive distribution ensures consistent cutting quality
• High cutting efficiency with reduced incidence of wire breakage
• Production monitored in high-definition for traceability
• Special treatment delivers improved wire toughness and abrasion resistance

Product Parameters (table)
Spec. & Model | Diameter of Finished Wire (μm) | Breaking force (N) | Purpose
0.16 mm | 160 ± 10 | ≥ 40 | Silicon carbide slicing
0.10 mm | 100–120 | ≥ 24 | Silicon carbide slicing
0.08 mm | 80–100 | ≥ 14.5 | Silicon carbide slicing

Characteristics / Technical specifications

• Intended use: Silicon carbide slicing
• Available finished wire diameters: 0.08 mm, 0.10 mm, 0.16 mm
• Breaking force (N): 0.08 mm — 80–100; 0.10 mm — 100–120; 0.16 mm — 160 ± 10
• Minimum breaking force thresholds: ≥ 14.5 N (0.08 mm), ≥ 24 N (0.10 mm), ≥ 40 N (0.16 mm)
• Design emphasis: enhanced toughness, abrasion resistance, reduced wire breakage, consistent abrasive distribution