Crystal polishing machine FTB300FP

for wafersindustrialwith automatic head changer

The FTB300FP CMP Tool is jointly developed by JieXin and a Japanese technical team. This equipment is designed for high throughput and cost-effectiveness while improving planarization performance to meet higher technical requirements (GBIR, SFQR). Wafer Size ≤12 inches GBIR ＜100nm Load&Unload Dry in wet out High-end domestic substitute of choice Reliability and stability-driven high-end domestic substitute High Throughput Equipped with 8 polishing heads and 3 workstations for enhanced productivity. Flexible Process Integration The robotic unloader can be combined with the cleaning system for drying treatment. Low Overall Cost The consumables are easy to replace, have a long service life, and thus reduce downtime.