Fully-automatic die bonder BM313A

for the semiconductor industryhigh-accuracy

BM313A Multifunction Die Bonder is mainly designed for the die bonding of semiconductor SiC pressure-assisted Ag sintering products, and can be extended to the die bonding of optical modules, sensors and metal packages in the future. High-end domestic substitute of choice Gain customer confidence and preference with high-speed and high-accuracy die bonding, modular design for flexible configuration, and stable and reliable performance Precise control High-accuracy X/Y/Z control, closed-loop and programmable force and temp control, auto accuracy calibration system, multi-function camera system Modular design Preheating module, static Gel-Pak, Feeder loading, fully automatic wafer load/unload system (optional) Intelligent display Visualized Mapping, visualized force control curve, visualized die bonding accuracy output