Fully-automatic die bonder BM314A

for the semiconductor industry

BM314A Soft Solder Die Bonder is mainly applied to the die bonding of power semiconductor devices, and is ideal for power devices and PV modules, such as TO series, DPAK series, PDFN series, DFT modules, etc. UPH Up to 9K Accuracy ±35μm@3σ Wafer Size ≤12 inches Oxygen Content ≤30mm Optimal solution for the packaging of high-power devices Outstanding tin writing and spanking effect, cutting-edge track temperature control system, capable of high-speed and high-accuracy die bonding and handling high-density leadframes Ultra-thin wafer handling Innovatively developed a high-precision bond head featuring full-travel constant force control for accurate control of both pickup and bonding force Core indicator control Oxygen content ≤20ppm, track heating temperature difference ≤±1℃, die placement accuracy ±35μm, tilt ＜30μm Modular design Interchangeable tin writing and spanking modules, auto wafer load/unload, multiple loading modes Visualized system IQC data monitoring system, production report generation system, bond force control curve simulation system