Crystal polishing machine JX300FP

siliconfor wafersindustrial

The JX300FP is a leading 12-inch CMP Tool developed based on ATW JX's advanced CMP technology, in response to cutting-edge industry demands. This equipment is equipped with high-performance polishing units and integrates advanced combined cleaning technology, delivering superior cleaning results. It enables nanometer-level global planarization of substrates, meeting the requirements of advanced process technologies. Wafer Size ≤12 inches GBIR ＜100nm Polishing Head 3-8Zone Load&Unload Dry in dry out Transcending conventional approaches Integrating polishing and cleaning into one, and combining technological advantages, with stability as the cornerstone and innovation as the cutting edge High Throughput Featuring 8 polishing heads and 3 workstations for enhanced productivity. Multi-zone Polishing Head Adjustable pressure for 3 to 8 zones, enabling high-precision surface profile control. Integrated Cleaning Unit Equipped with advanced cleaning technology, ensuring dry-in and dry-out processing.