Wedge bonder wire bonder B301D/B301B/B301C

B301D/B301B/B301C Aluminum Wire Bonder is a highly stable and precise equipment which can serve as a fast and efficient bonding solution for power transistors (including the automotive electronics and home appliances industries). Al Wire 4~20MIL Al Ribbon 20*4~80*10 UPH 9K Smart Bonder of China The wire bonder developed by ATW Coshin filled the gap of high-end bonding system for semiconductor assembly and test in the domestic market The wedge bonder for leadframe is mainly used in conventional power device packaging applications, meeting the customer’s needs for Al wire and Al power ribbon bonding. The equipment boasts high speed, high yield, and high stability, and is suitable for over 90% of the market's process scenarios, ensuring that every penny invested in the equipment is well spent. Strong Compatibility Suitable for Al wire and Al ribbon processes Ideal for products for multiple application scenarios such as TO series, IPM, IGBT, etc. High Capacity High capacity TO252-4R leadframe UPH up to 9K/H Low O&M cost Self-developed control system enables easy upgrade and maintenance High-end Intelligence BPM, GBS, ALC, and other functions facilitate easy operation Efficient Services Quick response within 2H 24/7 technical support