Crystal polishing machine TLT300MP

for wafersindustrialprecision

The TLT300MP is a 12-inch CMP equipment designed for laboratory applications based on current customer needs. This equipment features proprietary innovative technology, high-performance polishing units, and compatibility with both 8-inch and 12-inch wafers. It supports various materials and achieves ultra-high wafer surface flatness. With flexible process integration, it meets the requirements of high-precision manufacturing technologies. Wafer Size ≤12 inches Wafer Material Si, SiC, GaN, etc. Polishing Head 2 Platen 1 Meeting the diverse requirements of customers in different fields Can be flexibly applied in R&D and small-scale production in all fields of the semiconductor industry Multi-zone Polishing Head Optional 8-inch/12-inch Strong compatibility Multi-zone Polishing Head Flexible Process Integration, meets Advanced Process Technology Requirements.