Wafer dicing saw LAD5100

LAD5100 is an automatic 8" single spindle dicing saw designed for various dicing applications such as silicon, silicon carbide, ceramic, glass, QFN and DFN, delivering long-term reliability and outstanding durability. Continuous and stable Highly stable system, excellent hardware quality and continuously upgraded software system, satisfying 7*24 production requirement of customer. For customers in the semiconductor, optical module, and LED industries requiring precise dicing process, we provide 8’’ dicing saw, wafer cleaning machine, associated consumables, and comprehensive dicing process solutions.LAD5100 is an automatic 8’’ single spindle dicing saw designed for dicing workpieces up to 8’’. It features a high-power 1.8KW DC spindle, a high-rigidity gantry structure, imported high-precision screw drives and guide rails, dual-lens switching and alignment, which are further enhanced by self-developed software, so as to meet various customer processing needs. Highly efficient Top control system from Germany and self-developed motion control algorithms, achieving dicing efficiency comparable to foreign equivalent products. Highly adaptable NCS (Non-contact Setup) and BBD (Blade Breakage Detection) are standard features. Easy to use User-friendly operation interface, upgrade of software as requested by customer, easy for customer to import.