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X travel: 300 mm
Y travel: 400 mm
Repeatability: 1 µm
... is used for laser modification and cutting of silicon-based wafers in the semiconductor industry for 8-inch and above chip sealing and testing plants. •High quality There is no damage on the surface, no cutting ...
Farley Laserlab
X travel: 200 mm
Y travel: 300 mm
Repeatability: 2 µm
... picosecond laser is used for precision half cutting or full cutting of silicon and compound semiconductor wafers. • High quality Cutting line width is narrow (taking ultraviolet collimation ...
Farley Laserlab
X travel: 200 mm
Y travel: 300 mm
Repeatability: 2 µm
... picosecond laser is used for precision half cutting or full cutting of silicon and compound semiconductor wafers. • High quality Cutting line width is narrow (taking ultraviolet collimation ...
Farley Laserlab
X travel: 600 mm
Y travel: 600 mm
Z travel: 0 mm
... Graphite CNC Wire Cutting Machine uses circular diamond wire as cutting tool.And it has 4 cutting wires working at same time. The SVM60-60 is a vertical multi-wire ...
Vimfun Diamond Wire Saw
X travel: 500 mm
Y travel: 500 mm
Maximum cutting height: 500 mm
... Graphite Diamond
Wire
Cutting
Machine
Dual-System Cutting with Remote Diagnosis & Smart Control
The
Intelligent Graphite Diamond Wire ...
Vimfun Diamond Wire Saw
Y travel: 600 mm
Z travel: 600 mm
Cutting speed: 38 m/s
... consistency, and low labor involvement.
Closed-Loop Diamond Wire Technology – Fast & Stable Cutting
At the core of the SH60-60 is a circular (closed-loop) diamond
wire
cutting ...
Vimfun Diamond Wire Saw
X travel: 10 mm - 150 mm
Y travel: 10 mm - 150 mm
Cutting speed: 10 m/s - 500 m/s
... Metallographic cutting machine TEKNICUT BCM Cutting capacity up to 40 mm dia 7.5 HP, 3 Phase Motor Cut off wheel dia 14" & 16" Part Clamping up to 103mm ( Hollow tube ) Spindle ...
Cutting speed: 2,400 m/min
Overall length: 6,250 mm
Maximum width: 3,400 mm
... first single machine dual station and adjustable wheelbase design, this equipment is playing a significant role in the slicing process of silicon wafer manufacturing. It is compatible with the cutting ...
Qingdao Gaoce Technology Co., Ltd.
Cutting speed: 100 mm/s
Laser power: 15 W
Repeatability: 1 µm
... Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting processing 1. With 355nm UV laser, the cutting machine has stable performance, good light spot, and long-time stable ...
Han's Laser Technology Co., Ltd
Repeatability: 1 µm
... best quality range of Infrared Wafer Laser Scribing Machine. About:- This machine SG-50G has international competitive edge. It adopts 1064nm infrared laser as cutting tool, which ...
... ultra-thin wafers and scribing logic or system on chip (SoC) wafers on die attach films (DAFs) in one integrated system. * Unparalleled die break strength – Some wafers have delicate, brittle, low ...
Maximum cutting height: 305 mm
Tube diameter: 305 mm
Cutting speed: 20, 35 m/s
... to 300mm diameter into high quality wafers for the semiconductor industry. The new developed DW292-300 is capable to be run with slurry as well as diamond wire and includes sophisticated features to improve wafer ...
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