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X travel: 300 mm
Y travel: 400 mm
Repeatability: 1 µm
... is used for laser modification and cutting of silicon-based wafers in the semiconductor industry for 8-inch and above chip sealing and testing plants. •High quality There is no damage on the surface, ...
Farley Laserlab
X travel: 200 mm
Y travel: 300 mm
Repeatability: 2 µm
... picosecond laser is used for precision half cutting or full cutting of silicon and compound semiconductor wafers. • High quality Cutting line width is narrow (taking ...
Farley Laserlab
X travel: 200 mm
Y travel: 300 mm
Repeatability: 2 µm
... picosecond laser is used for precision half cutting or full cutting of silicon and compound semiconductor wafers. • High quality Cutting line width is narrow (taking ...
Farley Laserlab
Laser power: 1,500 W
... get started with a little training. Tags: small glass cutting machine, industrial glass cutting machine, glass sheet cutting machine Perfect ...
X travel: 10 mm - 150 mm
Y travel: 10 mm - 150 mm
Cutting speed: 10 m/s - 500 m/s
Metallographic cutting machine TEKNICUT BCM Cutting capacity up to 40 mm dia 7.5 HP, 3 Phase Motor Cut off wheel dia 14" & 16" Part Clamping up to 103mm ( Hollow ...
Cutting speed: 2,400 m/min
Overall length: 6,250 mm
Overall width: 3,400 mm
... first single machine dual station and adjustable wheelbase design, this equipment is playing a significant role in the slicing process of silicon wafer manufacturing. It is compatible with the cutting ...
Qingdao Gaoce Technology Co., Ltd.
Weight: 16,500 kg
... slicing process of silicon wafer manufacturing. The product adopts a brand new platformized design and industry-leadingadjustable small wheelbase design, which can be compatible with the cutting needs ...
Qingdao Gaoce Technology Co., Ltd.
Tube diameter: 201 mm
Cutting speed: 0 mm/min - 3 mm/min
Overall length: 5,400 mm
The is a special processing equipment where the diamond wire is used to cut semiconductor monocrystalline silicon and produce silicon wafers; it can process the silicon rods with diameter of 6 inches ...
Qingdao Gaoce Technology Co., Ltd.
Silicon wafer cutting line - environmental cutting, improvement of cutting efficiency - environmental friendly, recyclable cutting - for cutting of single crystal and polycrystalline silicon in photovoltaic industry cutting ...
Zhejiang Tony Electronic Co., Ltd.
Repeatability: 1 µm
... best quality range of Infrared Wafer Laser Scribing Machine. About:- This machine SG-50G has international competitive edge. It adopts 1064nm infrared laser as cutting ...
... ultra-thin wafers and scribing logic or system on chip (SoC) wafers on die attach films (DAFs) in one integrated system. * Unparalleled die break strength – Some wafers have delicate, ...
Maximum cutting height: 305 mm
Tube diameter: 305 mm
Cutting speed: 20, 35 m/s
... to 300mm diameter into high quality wafers for the semiconductor industry. The new developed DW292-300 is capable to be run with slurry as well as diamond wire and includes sophisticated features to ...
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