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Laser cutting machine AM027YA
for monocrystalline siliconwaferflexible

Laser cutting machine - AM027YA - Wuxi Autowell Technology Company - for monocrystalline silicon / wafer / flexible
Laser cutting machine - AM027YA - Wuxi Autowell Technology Company - for monocrystalline silicon / wafer / flexible
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Characteristics

Technology
laser
Material
for monocrystalline silicon
Product handled
wafer
Configuration
flexible
Other characteristics
modular

Description

Using non-destructive laser technology, PV cells are precisely cut to meet various custom segmentation requirements. Capacity inline: ≥11000 full cells/hour Capacity offline: ≥14000 full cells/hour Cell crack ratio <0.03% Cut accuracy (unequal strips) ≤±0.1mm Four Highs and One Modular Design Modular design and full process inspection module boost high yield, high capacity, high uptime, and high compatibility in cell cutting. Flexible layout Independent dual track; modular design for all functions. Intelligent inspection Full process inspection module; AI detection and inspection. Strong compatibility One-click switching between recipes; retrofitted to support multi-cut cell. High quality A design featuring wear-resistant materials and minimal dust generation for decreased adhesion of strips; adjustable spot size to mitigate cut losses.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.