Laser wafer etching machine D632B

D632B Laser Etching Machine is mainly designed for the polyfinger process of the back of TOPCon cells. By patterning and modifying the PSG film, it works in conjunction with subsequent wet process to achieve localized thinning of the back poly-Si film, thereby enhancing the efficiency and bifaciality of TOPCon cells. Capacity ≥9000 pcs/h@210R&300 fingers&single laser beam Suitable for 182-230mm Alignment accuracy ≤15um Patterned laser of excellent accuracy and great stability Excelling in stability, precision, and efficiency, it wins recognition from customers and the market with its outstanding pattern switching performance High stability Highly stabilized directional optical system. High uniformity High-uniformity shaped light spot; support spot size adjustment, without the need to change the DOE. High speed and high efficiency Ultra high-speed galvanometer scanning system, high-efficiency dust removal and optical path sealing. High precision High-precision positioning and alignment.