Automatic laser ablation system LA-BC-5000

LA-BC-5000 adopts high-accuracy and low thermal damage laser processing technology to precisely complete core processes such as patterned dielectric ablation, laser contact opening, and edge isolation on the rear side of cells. The processed area has neat boundaries, no thermal burns, and no substrate damage, effectively ensuring the passivation effect and conductivity of the cells. The equipment is ideal for the high-speed mass production of full-size ultra-thin wafers, and supports various BC cell mass production processes, helping customers achieve efficient cell performance improvement and enhance product market competitiveness, thereby adapting to the scaled iterative production of new-generation high-efficiency PV cells. Capacity ≥5000UPH@182/210R workpiece TBC/HBC Cell Beam Optimized beam shaping design High Capacity, Low Damage, High Stability Proven Verification Verified and assessed at the pilot line of a leading enterprise. Low-Damage Ablation High-uniformity and high-accuracy large spot ablation meets low-damage processing needs. Optimal Balance Combining P1 (ultra-violet) and P2 (green) optimally balances cost and efficiency. Flexible Retrofitting Support retrofitting of existing equipment, reducing the investment required for new production lines.