Packaging line for the electronics industry AM051BA

waferautomatic

This solution is designed to automate the handling of inspected wafers and it covers various processes such as unloading wafers from the inspection system, conveyance of wafers, wafer stack inspection, bagging, sorting, boxing and stacking onto pallets. Pioneered full automation of this production stage and commercialized it Ensures complete physical and data traceability of all wafers through full-process information The Wafer Automation Pack Line is a highly integrated automation system, with core processes including:Loading and conveying: Receive bins containing sorted wafers from the outlet areas of multiple wafer inspection systems, and convey the wafer stacks after converging. Appearance inspection: Typically leverage a vision system to capture the four lateral sides and chamfers of the wafer stack, focusing on detecting defects such as stain, adhesive, and chipping on the lateral side that may have been missed in the inspection process at the wafer inspection system. Bagging and packaging: Automatically place butter paper on the top and bottom of each wafer stack, then load the wafer stack into a packaging bag. After that, load wafer stacks into a packaging box based on inspection results. Palletizing can be integrated at end-of-line.Application scenarios: Mainly used in the end-of-line packaging process of wafer manufacturing workshops, which connects with the previous wafer inspection systems to form a complete automated loop from inspection to packaging. Technical advantages: Stable wafer stack inspection functionality lays a solid foundation for fully automated and intelligent operations saving subsequent manual re-inspection.