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Placement accuracy: 7 µm
... Bad mark search •Pre-defined fiducial geometry & customized teaching • Die Attach and Multi-Chip in one machine • Die pick from: wafer, waffle pack, Gel-Pak®, feeder • Die place to: substrate, boat, ...
BE Semiconductor Industries N.V.
Placement accuracy: 0.3 µm
... Automated Prototype2Production Bonder The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure ...
Placement accuracy: 2 µm
... Automatic Multi-Purpose Bonder The automated FINEPLACER® femto pro embodies the essence of the successful FINEPLACER® femto die bonder platform, offering high precision ...
Placement accuracy: 7 µm - 10 µm
... Overview
LQ-DB10 is a
fully automatic multi-chip placement system with
integrated loading and unloading, engineered for high-precision, high-stability production in semiconductor packaging, Mini LED and related ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 7 µm
... H3-DB20HF is a fully automatic pre-sintering placement equipment designed for R&D testing and mass production of SiC modules. The machine features a modular design with standard flow lines that can be connected in series and can be customized ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 7 µm
... Dispensing: pneumatic pulse dispensing with automatic tip calibration
Suzhou Lieqi Intelligent Equipment Co., Ltd.
... attaching thinner die and substrates, the iStack™ W+ offers a solution for wafer level die attach. Features & Options High Accuracy kit (5 μm) Mapping Functions (Substrate / Wafer) Wafer / Substrate contamination ...
... The CL2000 multi-purpose die bonder is a system designed for customers in the semiconductor and photonics packaging market. It can be confi gured to a wide range of tasks in a wide range of production environments. The ...
... Fully- Automatic Mounting Machine AC100 AC100 is a piece of high-stability and high-precision mounting equipment which is developed based on the precision assembly process requirements of modules and shell-and-tube ...
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