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... AD832i is an automatic epoxy die bonder engineered for high‑speed assembly of small packages. It supports 8" wafer handling and is optimized for QFN, SOIC, SOP and similar package types. The system integrates ...
ASM Assembly Systems
Placement accuracy: 7 µm
... Bad mark search •Pre-defined fiducial geometry & customized teaching • Die Attach and Multi-Chip in one machine • Die pick from: wafer, waffle pack, Gel-Pak®, feeder • Die place to: substrate, boat, ...
BE Semiconductor Industries N.V.
Placement accuracy: 7 µm - 10 µm
... Overview
LQ-DB10 is a
fully automatic multi-chip placement system with
integrated loading and unloading, engineered for high-precision, high-stability production in semiconductor packaging, Mini LED and related ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 7 µm
... H3-DB20HF is a fully automatic pre-sintering placement equipment designed for R&D testing and mass production of SiC modules. The machine features a modular design with standard flow lines that can be connected in series and can be customized ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 7 µm
... Dispensing: pneumatic pulse dispensing with automatic tip calibration
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 0.3 µm
... Automated Prototype2Production Bonder The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure ...
Finetech
... attaching thinner die and substrates, the iStack™ W+ offers a solution for wafer level die attach. Features & Options High Accuracy kit (5 μm) Mapping Functions (Substrate / Wafer) Wafer / Substrate contamination ...
... The CL2000 multi-purpose die bonder is a system designed for customers in the semiconductor and photonics packaging market. It can be confi gured to a wide range of tasks in a wide range of production environments. The ...
... Fully- Automatic Mounting Machine AC100 AC100 is a piece of high-stability and high-precision mounting equipment which is developed based on the precision assembly process requirements of modules and shell-and-tube ...
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