Fully-automatic die bonder CL2000

The CL2000 multi-purpose die bonder is a system designed for customers in the semiconductor and photonics packaging market. It can be confi gured to a wide range of tasks in a wide range of production environments. The base system provides everything needed for a tremendous range of applications. A pre-confi gured high precision gantry motion system carries the tools for die bonding or testing. Of course the machine is designed for industrial production environments. In combination with a selection of a variety of functional modules the system becomes your individual production cell. Built for Industrial Use • Rugged steel base production cell • Hardware interlock circuit for save operation • Ergonomic HUI • Full featured machine switchboard • Integrated air and vac control • Operation console for comfort access of basic machine function