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... solves today's need for small and thin die bonding and offers capabilities for tomorrow's challenges as well. Accurate die pre-centering ensures minimal die tilt and ...
Panasonic Factory Automation Company
... solves today's need for small and thin die bonding and offers capabilities for tomorrow's challenges as well. Accurate die pre-centering ensures minimal die tilt and ...
Panasonic Factory Automation Company
Panasonic's process-flexible, MD-P300 flip chip bonder combines flip chip, thermosonic, and thermocompression bonding in a single, small footprint solution. Flexible bonding tools change from thermosonic ...
Panasonic Factory Automation Company
The “LAPLACE-VC” laser bonder is a system suited for the vertical attachment of chips or similar devices loaded into the machine in waffle packs to various carrier substrates loaded manually onto the machine’s work stage. The ...
Pac Tech – Packaging Technologies GmbH
... LAPLACE-system provides an integrated solution for flip chip assembly. The laser assisted assembly is applied for soldering, ACF and NCP interconnections. The optional dispensing unit in the flip chip ...
Pac Tech – Packaging Technologies GmbH
The BL100 is a table-top die bonder. It comes in a compact design with a footprint not much larger than a typewriter. It can be operated by seating personnel for best performance of the ...
Fully-Automatic Mounting Machine AC100 AC100 is a piece of high-stability and high-precision mounting equipment which is developed based on the precision assembly process requirements of modules and ...
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