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Placement accuracy: 5 µm
... solves today's need for small and thin die bonding and offers capabilities for tomorrow's challenges as well. Accurate die pre-centering ensures minimal die tilt and a novel ejector design ...
Panasonic Factory Automation Company
Placement accuracy: 0.3 µm
... Automated Prototype2Production Bonder The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications ...
Finetech
Placement accuracy: 2 µm
... Automatic Multi-Purpose Bonder The automated FINEPLACER® femto pro embodies the essence of the successful FINEPLACER® femto die bonder platform, offering high precision and versatility with a focus ...
Finetech
Placement accuracy: 3 µm
... Multi-Purpose Manual Die Bonder The FINEPLACER® pico 2 is a versatile manual die bonder with placement accuracy down to 3 µm. Quick to set up and easy to operate, it is ideal for ...
Finetech
Placement accuracy: 1.5 µm - 3 µm
... LQ-VADB30P is a high-precision multi-chip bonding machine optimized from its predecessor, offering high placement accuracy, process flexibility and throughput suitable for both high-volume and high-precision chip mounting applications.
Key features
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Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 0 µm - 12.5 µm
... LQ-DA1201 is a high-speed, high-precision die bonder for IC packaging designed for solid-state mounting processes. The machine supports silver paste placement and the DAF process, accepts LF and substrate feed, and its ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 5 µm - 5 µm
The LQ-FC200US is a hot-press ultrasonic flip-chip mounting system designed for high-throughput, high-precision solid-state mounting and multi-process bonding. It features an operator-friendly large color touch panel with dialog-style software and supports ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
... The “LAPLACE-VC” laser bonder is a system suited for the vertical attachment of chips or similar devices loaded into the machine in waffle packs to various carrier substrates loaded manually onto the machine’s work stage. The system ...
Pac Tech – Packaging Technologies GmbH
... The BL100 is a table-top die bonder. It comes in a compact design with a footprint not much larger than a typewriter. It can be operated by seating personnel for best performance of the manual tasks within ...
... Fully-Automatic Mounting Machine AC100 AC100 is a piece of high-stability and high-precision mounting equipment which is developed based on the precision assembly process requirements of modules and shell-and-tube ...
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