Micro assembly die bonders

7 companies | 23 products
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flip-chip die bonder
flip-chip die bonder
MD-P200US2

Placement accuracy: 5 µm

... solves today's need for small and thin die bonding and offers capabilities for tomorrow's challenges as well. Accurate die pre-centering ensures minimal die tilt and a novel ejector design ...

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Panasonic Factory Automation Company
eutectic die bonder
eutectic die bonder
NOVA Pro

Placement accuracy: 1 µm

... li>

  • Advanced packaging epoxy die attach
  • Eutectic in‑situ die attach
  • MEMS and sensor die attach
  • WLP / eWLP


  • Key Features
    • High‑precision die
    ...

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    ASM Assembly Systems
    multi-chip die bonder
    multi-chip die bonder
    LQ-VADB30P

    Placement accuracy: 1.5 µm - 3 µm

    ... LQ-VADB30P is a high-precision multi-chip bonding machine optimized from its predecessor, offering high placement accuracy, process flexibility and throughput suitable for both high-volume and high-precision chip mounting applications.

    Key features

    • Up
    ...

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    Suzhou Lieqi Intelligent Equipment Co., Ltd.
    die-attach die bonder
    die-attach die bonder
    LQ-DA1201

    Placement accuracy: 0 µm - 12.5 µm

    ... LQ-DA1201 is a high-speed, high-precision die bonder for IC packaging designed for solid-state mounting processes. The machine supports silver paste placement and the DAF process, accepts LF and substrate feed, and its ...

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    Suzhou Lieqi Intelligent Equipment Co., Ltd.
    die-attach die bonder
    die-attach die bonder
    LQ-FC200US

    Placement accuracy: 5 µm - 5 µm

    The LQ-FC200US is a hot-press ultrasonic flip-chip mounting system designed for high-throughput, high-precision solid-state mounting and multi-process bonding. It features an operator-friendly large color touch panel with dialog-style software and supports ...

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    Suzhou Lieqi Intelligent Equipment Co., Ltd.
    sub-micron die bonder
    sub-micron die bonder
    FINEPLACER® femto 2

    Placement accuracy: 0.3 µm

    ... Automated Prototype2Production Bonder The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications ...

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    Finetech
    micro assembly die bonder
    micro assembly die bonder
    LaPlace – VC

    ... The “LAPLACE-VC” laser bonder is a system suited for the vertical attachment of chips or similar devices loaded into the machine in waffle packs to various carrier substrates loaded manually onto the machine’s work stage. The system ...

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    Pac Tech – Packaging Technologies GmbH
    thermal die bonder
    thermal die bonder
    BL100

    ... The BL100 is a table-top die bonder. It comes in a compact design with a footprint not much larger than a typewriter. It can be operated by seating personnel for best performance of the manual tasks within ...

    fully-automatic die bonder
    fully-automatic die bonder
    AC100

    ... Fully-Automatic Mounting Machine AC100 AC100 is a piece of high-stability and high-precision mounting equipment which is developed based on the precision assembly process requirements of modules and shell-and-tube ...

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