Micro assembly die bonder LaPlace – VC

high-accuracy

The “LAPLACE-VC” laser bonder is a system suited for the vertical attachment of chips or similar devices loaded into the machine in waffle packs to various carrier substrates loaded manually onto the machine’s work stage. The system uses a unique patented laser thermode tool, which is integrated in the vacuum pick and place unit of the bonder. Due to the high flexibility of the laser thermode, the system requires only a thin layer of solder on the substrate. Highlights • In-Line capability • High throughput • Rotation correction and automatic alignment Options • Wafer Handling Systems • Dispenser System • Substrate Feeder • Direct Die Feeder • UV Curing Benefits • In-Line capability • High throughput • Available with different accuracy specs: ±25µm (standard), ±5µm, ±10µm (optional) • Vision system • Rotation correction and automatic alignment • 90 degree flip unit to present Die to the bonding tool • Temperature control unit • Laser class 1 certified tool