Flip-chip die bonder LaPlace – FC

for micro assembly

LaPlace – FC The LAPLACE-system provides an integrated solution for flip chip assembly. The laser assisted assembly is applied for soldering, ACF and NCP interconnections. The optional dispensing unit in the flip chip assembly platform allows a maximal flexibility for flux, solder paste and/or ACF, NCP dispense. Highlights • Flip chip placement, reflow & curing in one step • Fluxfree reflow with laser • No additional reflow or curing • Suitable for Flip Chip Soldering and adhesive Flip Chip: ACF, NCP, ICA • Substrate materials: • – PI, PVC, PE, Polyester • – Paper based low cost substrates and others Options • Wafer Handling Systems • Reel to Reel Unit • Dispenser System Benefits • In-Line Capability • High Throughput • Available with different accuracy specs: ±25µm (standard), ±5µm, ±10µm (optional) • Vision System • Temperature Control Unit • Laser Class 1