Thermal die bonder BL100

for micro assembly

The BL100 is a table-top die bonder. It comes in a compact design with a footprint not much larger than a typewriter. It can be operated by seating personnel for best performance of the manual tasks within the bonding process. A split optic vision sytem concurrently observes and as an overlay displays both the chip and the substrate in real time. This way the operator intuitively aligns the componets with a high accuracy. A bond head carries the pick-up tool. The bond head is operated manually along a gantry with the ability for fine adjustment. The working area underneath the XY overhead gantry stage is equipped with the heating plate and Gelpak/waffle pak bays for both the inbound and outbound components.