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Automated Prototype2Production Bonder The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete ...
Finetech
Multi-Purpose Manual Die Bonder The FINEPLACER® pico 2 is a versatile manual die bonder with placement accuracy down to 3 µm. Quick to set up and easy to operate, ...
Finetech
... times, even when working in the sub-micron range. The table top die bonder FINEPLACER® lambda 2 shares a common module range and innovative operating software with Finetech's automatic ...
Finetech
Panasonic's MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. ...
The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 12” ...
BE Semiconductor Industries N.V.
... specialized configuration of the 6500 Die Bonder for wafer scale packaging eutectic die bonding is also available. Wafer Scale Packaging (WSP) Wafer Scale Packaging (WSP) eutectic ...
PALOMAR TECHNOLOGIES
The latest IGBT Power Diebonder of AUTOTRONIK is introduced. Its advantages are these multiple types and specifications of materials are compatible with one high-precision mounting equipment at the same time.
The T-5000series Die Bonder is what we would like to call an evolution. The result of 40 years experience in developing high quality Die Bonder is based on a new frame ...
InduBond ® 230N is a new generation of the inductive bonding machines by Chemplate for layer to layer pin registration and bonding the stack-up of inner layers and prepregs of a multilayer printed circuit. This process allows to laminate ...
InduBond®
... processes. Features Fully automated processing with manual loading and unloading including external cooling station Compatible with EVG mechanical and optical aligners Single- or double-chamber automated ...
EV Group
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