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Placement accuracy: 0.3 µm
... Automated Prototype2Production Bonder The FINEPLACER® femto 2 is a fully- automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure ...
Finetech
Placement accuracy: 3 µm - 3 µm
... wafers and continuous mixed-device runs while maximizing uptime.
Finetech
Placement accuracy: 2 µm
... Automatic Multi-Purpose Bonder The automated FINEPLACER® femto pro embodies the essence of the successful FINEPLACER® femto die bonder platform, offering high precision ...
Finetech
Placement accuracy: 7 µm - 10 µm
... Overview
LQ-DB10 is a
fully automatic multi-chip placement system with integrated loading and unloading, engineered for high-precision, high-stability production in semiconductor packaging, Mini LED and related photonics applications. ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 7 µm
... Dispensing: pneumatic pulse dispensing with automatic tip calibration
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 1 µm - 5 µm
... features an
automatic tool change system, making it suitable for R&D and industrial mass production.
Key features
- Fully automatic placement workflow
- High placement accuracy
- High
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 5 µm
... Panasonic's MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. The wafer ...
Placement accuracy: 0.5 µm - 0.8 µm
... High-Resolution Vision Systems Ensures precise alignment and inspection, crucial for maintaining high quality standards. Thin Die Capability Expertly handles thin dies, expanding your application possibilities. Superior Process ...
BE Semiconductor Industries N.V.
... specialized configuration of the 6500 Die Bonder for wafer scale packaging eutectic die bonding is also available. Wafer Scale Packaging (WSP) Wafer Scale Packaging (WSP) eutectic die ...
PALOMAR TECHNOLOGIES
... attaching thinner die and substrates, the iStack™ W+ offers a solution for wafer level die attach. Features & Options High Accuracy kit (5 μm) Mapping Functions (Substrate / Wafer) Wafer / Substrate contamination ...
... The latest IGBT Power Diebonder of AUTOTRONIK is introduced. Its advantages are these multiple types and specifications of materials are compatible with one high-precision mounting equipment at the same time. ...
... The T-5000series Die Bonder is what we would like to call an evolution. The result of 40 years experience in developing high quality Die Bonder is based on a new frame concept and fulfils ...
InduBond ® 230N is a new generation of the inductive bonding machines by Chemplate for layer to layer pin registration and bonding the stack-up of inner layers and prepregs of a multilayer printed circuit. This process allows to laminate the multilayer ...
InduBond®
... processes. Features Fully automated processing with manual loading and unloading including external cooling station Compatible with EVG mechanical and optical aligners Single- or double-chamber automated system Fully ...
EV Group
... The CL2000 multi-purpose die bonder is a system designed for customers in the semiconductor and photonics packaging market. It can be confi gured to a wide range of tasks in a wide range of production environments. The ...
... and components, etc.) The equipment can be provided with modules such as automatic loading & unloading and product pre-curing, and can automatically realize functions of automatic substrate loading & unloading, dispensing ...
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