- Production Machines
- Machine for the electronics industry
- Die-attach die bonder
- ASM Assembly Systems
Die-attach die bonder INFINITEepoxyautomatedfor the semiconductor industry
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Characteristics
- Technology
- epoxy, for die-attach
- Operational mode
- automated
- Applications
- for the semiconductor industry, for wafers
- Other characteristics
- high-accuracy, with optical alignment system
Description
Product overview
The INFINITE is a next-generation 12” automatic die bonder designed for high-precision placement and stable dispensing. It integrates dedicated technologies for epoxy control, level sensing, motion control and fast vision inspection. The system supports 12” wafer handling, high-density lead frames (example: 300 × 100 mm), optional uplook optics to enhance inspection and a universal work holder to accommodate various package types.
Features
Additional iFeatures and capabilities
Technical specifications
The INFINITE is a next-generation 12” automatic die bonder designed for high-precision placement and stable dispensing. It integrates dedicated technologies for epoxy control, level sensing, motion control and fast vision inspection. The system supports 12” wafer handling, high-density lead frames (example: 300 × 100 mm), optional uplook optics to enhance inspection and a universal work holder to accommodate various package types.
Features
- High throughput for production environments
- Excellent XY placement accuracy
- High-density lead-frame handling (example 300 × 100 mm)
- Optional uplook optics to improve bonding and inspection accuracy
- Integrated iFeatures: iTouch, iSense, iDispense
Additional iFeatures and capabilities
- iDispense: epoxy tailing control
- iSense: precise level measurement
- iTouch: bonding motion control for thin die and special epoxies
- iBalance: vibration protection for dispensing and bonding stability
- iFlash: fast vision inspection technology
- iFlat: warpage handling
Technical specifications
- Wafer handling: 12” (12-inch)
- Placement accuracy: excellent XY placement accuracy
- Lead-frame handling: high-density lead-frame handling, example dimension 300 × 100 mm
- Optics: uplook optics available (optional) to enhance bonding/inspection accuracy
- Work holder: universal design supporting various package types
- Integrated technologies: iDispense, iSense, iTouch, iBalance, iFlash, iFlat
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IC & Discrete
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.