- Production Machines
- Machine for the electronics industry
- ASM Assembly Systems
Bonding system AERO PRO
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Description
Product overview
AERO PRO integrates patented X-Power thermosonic bonding technology, ECP looping enhancements and an intelligent monitoring system for quality assurance.
Features
Technical specifications
AERO PRO integrates patented X-Power thermosonic bonding technology, ECP looping enhancements and an intelligent monitoring system for quality assurance.
Features
- Integrate with ASMPT system for Data Analytics and KPI Management
- 20% smaller footprint and UPH increase up to 38%
- New anti-reaction XY stage for higher degree of stability
- New AeroBRO Bonding & Looping Database for easy setup
- BGA, Memory, QFN and other general applications
- Machine Health Auto Recovery and diagnostic functions to improve MTBA
- Automation ready: compatible with AGV / RGV / OHT systems
Technical specifications
- Patented X-Power thermosonic bonding technology
- ECP looping enhancements
- Intelligent monitoring system for quality assurance
- Integration capability with ASMPT Data Analytics and KPI Management
- Footprint reduction: ~20% smaller compared to previous generation
- UPH (units per hour) improvement: up to 38%
- Anti-reaction XY stage for improved stability
- AeroBRO Bonding & Looping Database supporting BGA, Memory, QFN and other general applications
- Machine Health Auto Recovery and diagnostic functions to improve MTBA
- Automation-ready: compatible with AGV, RGV and OHT systems
Catalogs
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IC & Discrete
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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