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- Machine for the electronics industry
- ASM Assembly Systems
Bonding system AERO PRO
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Description
Product overview
AERO PRO integrates patented X-Power thermosonic bonding technology, ECP looping enhancements and an intelligent monitoring system for quality assurance.
Features
Technical specifications
AERO PRO integrates patented X-Power thermosonic bonding technology, ECP looping enhancements and an intelligent monitoring system for quality assurance.
Features
- Integrate with ASMPT system for Data Analytics and KPI Management
- 20% smaller footprint and UPH increase up to 38%
- New anti-reaction XY stage for higher degree of stability
- New AeroBRO Bonding & Looping Database for easy setup
- BGA, Memory, QFN and other general applications
- Machine Health Auto Recovery and diagnostic functions to improve MTBA
- Automation ready: compatible with AGV / RGV / OHT systems
Technical specifications
- Patented X-Power thermosonic bonding technology
- ECP looping enhancements
- Intelligent monitoring system for quality assurance
- Integration capability with ASMPT Data Analytics and KPI Management
- Footprint reduction: ~20% smaller compared to previous generation
- UPH (units per hour) improvement: up to 38%
- Anti-reaction XY stage for improved stability
- AeroBRO Bonding & Looping Database supporting BGA, Memory, QFN and other general applications
- Machine Health Auto Recovery and diagnostic functions to improve MTBA
- Automation-ready: compatible with AGV, RGV and OHT systems
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IC & Discrete
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