- Production Machines
- Machine for the electronics industry
- Eutectic die bonder
- ASM Assembly Systems
Eutectic die bonder AD832Uepoxyautomatedfor the semiconductor industry
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Characteristics
- Technology
- epoxy, eutectic
- Operational mode
- automated
- Applications
- for the semiconductor industry, for wafers
- Other characteristics
- high-accuracy, configurable
- Placement accuracy
Max.: 80 µm
Min.: 0 µm
Description
Product overview
AD832U is an automatic eutectic die bonder delivering precise placement for a wide range of horizontal small discrete packages (examples: SOD323, SOD923, SOT113). With a 300 x 100 mm handling area and support for wafers up to 8", the AD832U is engineered for high-throughput eutectic die bonding in modern production lines.
Key features
Technical specifications
Applications and benefits
AD832U is an automatic eutectic die bonder delivering precise placement for a wide range of horizontal small discrete packages (examples: SOD323, SOD923, SOT113). With a 300 x 100 mm handling area and support for wafers up to 8", the AD832U is engineered for high-throughput eutectic die bonding in modern production lines.
Key features
- Automatic eutectic die bonding for horizontal small packages
- Handling area: 300 x 100 mm
- Supports wafer sizes up to 8"
- Placement accuracy and cycle-time optimized for throughput
- Capable of high-density lead frame handling
- Optional modules: multi-angle bonding; flux eutectic and epoxy bonding
Technical specifications
- Type: Automatic eutectic die bonder
- Package compatibility: horizontal small discrete packages (SOD323, SOD923, SOT113, etc.)
- Handling capability: 300 x 100 mm
- Maximum wafer size: up to 8"
- Performance: precise placement suitable for high-volume production
- Optional modules: multi-angle bonding; flux eutectic and epoxy bonding
- Suitable for: high-density lead frame handling
Applications and benefits
- Mass production of discrete semiconductor packages
- Integration into assembly lines requiring compact-package eutectic bonding
- Flexible configuration with optional modules to meet specific process requirements
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IC & Discrete
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.