Die-attach die bonder AD8312FC

flip-chipautomatedfor the semiconductor industry

Product overview
The AD8312FC is a 2‑in‑1 automatic flip‑chip and direct die attach machine engineered for low‑pin‑count flip‑chip packages such as SOIC, SO, QFN, BGA and LGA. It supports direct die bonding and integrates inline capabilities for efficient high‑volume assembly while delivering precise placement through its patented double decoupled bond head system.

Features

• 2‑in‑1 flip chip and direct die attach machine
  • Simple and fast conversion between flip‑chip and direct die bonding processes
• High‑speed bonding enabled by patented double decoupled bond head system
• Comprehensive inspection algorithms supporting inspections at multiple locations
• Excellent placement accuracy for low‑pin‑count packages
• High‑density lead frame handling capability

Technical specifications

• Machine type: 2‑in‑1 flip‑chip and direct die attach (automatic)
• Supported package types: SOIC, SO, QFN, BGA, LGA and other low‑pin‑count flip‑chip packages
• Bonding system: patented double decoupled bond head for high‑speed bonding
• Production: inline capabilities for high‑volume assembly
• Inspection: all‑round/comprehensive inspection algorithms for multiple inspection locations
• Placement: excellent placement accuracy suitable for fine pitch and low‑pin devices
• Handling: capability to process high‑density lead frames
• Changeover: simple and fast conversion between flip‑chip and direct die attach modes