Bonding system Eagle AERO

Product Overview
The Eagle AERO is the first commercial system to integrate the patented X-Power thermosonic bonding technology with the Aeroducer dual-frequency transducer (X and Y directions). Designed for high-precision wire bonding applications, it includes AeroEye management software for process monitoring and quality assurance.

Key Features

• Up to 30% higher UPH
  • Measured for standard copper (Cu) wire applications
• 22μm bonded ball size
  • Achieves 22μm ball size using 0.5 mil wire
• Application readiness up to 30μm
• Market-specific configurations
  • iHawk AERO: optimized for low pin-count discrete applications

Technical Specifications

• Bonding technology: patented X-Power thermosonic bonding
• Transducer: Aeroducer dual-frequency (X and Y directions)
• Software: AeroEye management and quality assurance
• Performance: up to 30% increase in UPH (typical Cu wire application)
• Bonded ball size: down to 22μm with 0.5 mil wire
• Application readiness: up to 30μm
• Available configuration: iHawk AERO for low pin-count discrete assemblies

Applications

• Semiconductor packaging and IC assembly
• High-density interconnects and fine-pitch components
• Discrete device bonding with low pin counts

Configurations & Software

• Optional configurations to suit production volume and component type
• iHawk AERO: variant for low pin-count discrete applications
• AeroEye: process monitoring, data logging and QA support