- Production Machines
- Machine for the electronics industry
- Epoxy die bonder
- ASM Assembly Systems
Epoxy die bonder AD832ifully-automaticfor the semiconductor industryfor wafers
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Characteristics
- Technology
- epoxy
- Operational mode
- fully-automatic
- Applications
- for the semiconductor industry, for wafers
- Other characteristics
- high-accuracy
Description
Overview
The AD832i is an automatic epoxy die bonder engineered for high‑speed assembly of small packages. It supports 8" wafer handling and is optimized for QFN, SOIC, SOP and similar package types. The system integrates ultra‑small dot dispensing and 6 mil die handling with a patented bond arm/head for precise placement and high throughput.
Key features
Technical specifications
The AD832i is an automatic epoxy die bonder engineered for high‑speed assembly of small packages. It supports 8" wafer handling and is optimized for QFN, SOIC, SOP and similar package types. The system integrates ultra‑small dot dispensing and 6 mil die handling with a patented bond arm/head for precise placement and high throughput.
Key features
- Ultra‑small dot dispensing capability
- 6 mil ultra‑small die handling
- High‑density leadframe handling support
- Patented bond arm and bond head design
- Dual dispensing system for process flexibility
- Graphical SPC output integrated with the latest IQC system
Technical specifications
- Model: AD832i
- Type: Automatic die bonder
- Bonding method: Epoxy die bonding
- Wafer handling: 8" wafer handling
- Target packages: QFN, SOIC, SOP and similar small packages
- Dot dispensing: Ultra‑small dot dispensing capability
- Die handling capability: Ultra‑small die handling, down to 6 mil
- Leadframe handling: High‑density leadframe support
- Bond head: Patented bond arm / bond head design
- Dispensing system: Dual dispensing
- Data & quality: Graphical SPC data with latest IQC integration
- Automation level: Fully automatic, high‑speed
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IC & Discrete
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.