Encapsulation molding machine 3Ge

multi-stationfor the packaging industryadjustable

Product overview
The 3Ge is an encapsulation and molding system designed for high-density package production and smart-factory environments. Building on IDEALmold 3G, 3Ge delivers approximately 30% faster conversion time, revised mechanical modules and an energy-efficient pre-heater. It includes predictive maintenance capabilities to support higher uptime and lower manual intervention.

Features

• Ultra High Density (UHD) processing area: 100 mm W × 300 mm L
• Configurable press layout: 1 to 4 presses, optional 170T press
• Integration ready: FOL inline and PEP inline compatible
• Factory communications: SECS/GEM option available
• Advanced packaging: support for advanced package options
• PGS Top Gate Molding: ASMPT patented capability
• DSC compatibility: prepared for DSC molding solution
• Vacuum system: SmartVac delivering ~3 Torr vacuum performance

Technical specifications

• Product name: 3Ge
• Application: Encapsulation / Molding system for semiconductor packaging
• Smart factory: Predictive maintenance software included / ready
• Performance: ~30% faster conversion time vs IDEALmold 3G
• Mechanical: Improved mechanical module design for faster changeover
• Energy: Power-saving pre-heater module
• UHD capability: 100 mm (W) × 300 mm (L)
• Press configuration: 1–4 presses configurable; 170T option
• Integration: FOL inline & PEP inline integration ready
• Communications: SECS/GEM option ready
• Packaging support: Advanced packages option ready
• Molding tech: ASMPT patented PGS Top Gate Molding
• DSC: Ready for DSC molding solution
• Vacuum: SmartVac achieving ~3 Torr