- Production Machines
- Machine for the electronics industry
- Die-attach die bonder
- ASM Assembly Systems
Die-attach die bonder AD8312Plusflip-chipepoxyautomated
Add to favorites
Compare this product
Characteristics
- Technology
- flip-chip, epoxy, for die-attach
- Operational mode
- automated
- Applications
- for the semiconductor industry, for wafers
- Other characteristics
- high-accuracy, configurable, with optical alignment system
Description
Product Overview
The AD8312Plus is a 12″ automatic die bonder engineered for high-throughput production with advanced process control. It supports 12-inch wafers, high-density leadframe handling up to 300 x 100 mm, uplook optics for improved bond alignment, and a universal work holder compatible with multiple package types. Integrated modules provide precise dispensing, level sensing, motion control, vibration protection, fast vision inspection and warpage handling.
Features
Technical specifications
The AD8312Plus is a 12″ automatic die bonder engineered for high-throughput production with advanced process control. It supports 12-inch wafers, high-density leadframe handling up to 300 x 100 mm, uplook optics for improved bond alignment, and a universal work holder compatible with multiple package types. Integrated modules provide precise dispensing, level sensing, motion control, vibration protection, fast vision inspection and warpage handling.
Features
- High-speed automatic die bonding with proven precision
- Support for high-density leadframes (up to 300 x 100 mm)
- Uplook optics and enhanced placement accuracy for tight tolerances
- Universal work holder accommodating various package formats
- Configurable platforms: AD8312Plus (high-speed) and AD8312FC (direct die attach + flip chip)
Technical specifications
- Product type: Automatic die bonder
- Wafer compatibility: 12″
- Leadframe handling: high-density, up to 300 x 100 mm
- Placement accuracy: high-precision XY placement
- Optics: uplook optics for bond alignment
- Universal work holder: supports multiple package types
- Integrated technologies: iDispense (epoxy tailing control), iSense (level measurement), iTouch (motion control for thin die and special epoxies), iBalance (vibration protection), iFlash (fast vision inspection), iFlat (warpage handling)
- Available configurations: AD8312Plus (high-speed), AD8312FC (supports direct die attach and flip chip)
Catalogs
No catalogs are available for this product.
See all of ASM Assembly Systems‘s catalogsOther ASM Assembly Systems products
IC & Discrete
Related Searches
- Pick-and-place system
- SMT pick-and-place system
- Wafer bonder
- Automatic pick-and-place system
- Automated wafer bonder
- High-accuracy die bonder
- Flip-chip die bonder
- High-speed pick-and-place system
- Die-attach die bonder
- Fully-automatic die bonder
- Micro assembly die bonder
- Epoxy die bonder
- Modular pick-and-place system
- Eutectic die bonder
- Wedge bonder
- Compact pick-and-place system
- Multi-chip die bonder
- Automatic wire bonder
- Wafer die bonder
- Configurable die bonder
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.