{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
Placement accuracy: 5 µm
... Panasonic's MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. The wafer ...
Panasonic Factory Automation Company
Placement accuracy: 10 µm
... Capability •Single pass production for complex products • Die attach, flip chip, multi-chip in one machine • Epoxy writing & stamping, flux dipping • Die pick from wafer, waffle pack, gel pack, feeder • Die ...
BE Semiconductor Industries N.V.
Placement accuracy: 3 µm
... components
Technical specifications
- Mounting process: Epoxy adhesive mounting (dipping, scribing); supports face-up and face-down mounting.
- Placement accuracy:
Placement accuracy: 3 µm - 7 µm
... fully automated eutectic surface-mount system for advanced packaging that supports eutectic soldering and silver-adhesive ( epoxy) dispensing. It is engineered for production and R&D scenarios requiring multichip handling, automatic tool ...
Placement accuracy: 3 µm - 3 µm
... mixed-device runs while maximizing uptime.
Finetech
... specialized configuration of the 6500 Die Bonder for wafer scale packaging eutectic die bonding is also available. Wafer Scale Packaging (WSP) Wafer Scale Packaging (WSP) eutectic die ...
PALOMAR TECHNOLOGIES
... The iStack™ S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. Its enhanced process features include the face-down process, In-Situ ...
... Assembly Applications: PLATFORM FOR DIE ASSEMBLY AND SMALL SMD PLACEMENT Lab and Prototype (Lab, Jewelry, Watches, smd, BGA,..) Small parts handling capability Solder paste SMD Reflow Eutectic die bonding High ...
the best suppliers