Epoxy die bonder MPS

MPS : for small chips and SMD Parts Assembly Applications: PLATFORM FOR DIE ASSEMBLY AND SMALL SMD PLACEMENT Lab and Prototype (Lab, Jewelry, Watches, smd, BGA,..) Small parts handling capability Solder paste SMD Reflow Eutectic die bonding High precise pick and place of very small and delicate devices The design proveds an easy solution for gluing Video interface compatible for Ultra-HD camera true vertical motion side camera: can be tilted at any angle High reliable tool. Requires no training. Features / Parameters: Low picking force: < 10g adjustable bond force Rocking head, dispensing/stamping Power: 100 / 230 VAC 300 Watt Vacuum: integrated in system Dimension: 270x500x352 mm Weight: 17 kg