{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated ...
BE Semiconductor Industries N.V.
... optionally 14), 5 eject tools Stamping tools and calibration tools possible Die attach, flip chip and multi-chip in one machine Die pick from: wafer, waffle pack, Gel-Pak®, feeder Die ...
BE Semiconductor Industries N.V.
... Pre-defined fiducial geometry & customized teaching Pick & Place Head - Die Attach, Flip Chip and Multi-Chip in one machine - Die pick from: wafer, waffle pack, Gel-Pak®, feeder - ...
BE Semiconductor Industries N.V.
... production The new Datacon 2200 evo advanced is the latest edition in the well- established and field proven Multi Module Attach platform of Besi.With an all new gantry & controller system as well as a completely new ...
BE Semiconductor Industries N.V.
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications ...
BE Semiconductor Industries N.V.
... new Esec Die Bonder 2009 SSIE is engineered to meet all upcoming challenges in power die attach. Its unprecedented productivity and process control are unmatched in the ...
BE Semiconductor Industries N.V.
Thermo Compression bonding is the key technology for current 2.5D/3D C2S and C2W packaging, with TC-CUF as the currently established process for 3D memory applications. The Datacon 8800 TC advanced sets the new benchmark based on the ...
BE Semiconductor Industries N.V.
The Flip Chip Bonder Esec 2100 FC hS is the 3rd generation of the market leading High Speed FC platform, capable of running an extensive range of FC applications such as FCOL, FC‑MIS, FC‑SIP, FCCSP, FCBGA as well as emerging ...
BE Semiconductor Industries N.V.
The iStack™ S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. Its enhanced process features include the face-down ...
Kulicke & Soffa
With an emerging trend in attaching thinner die and substrates, the iStack™ W+ offers a solution for wafer level die attach. Features & Options High Accuracy kit (5 μm) Mapping ...
Kulicke & Soffa
The ACCμRA M is a manual Flip-Chip Bonder that permits to reach ± 3 μm post-bond accuracy. The only motorized axis is the arm, which controls precisely the bonding force. Combining and synchronizing the arm with the ...
... Assembly Applications: PLATFORM FOR DIE ASSEMBLY AND SMALL SMD PLACEMENT Lab and Prototype (Lab, Jewelry, Watches, smd, BGA,..) Small parts handling capability Solder paste SMD Reflow Eutectic die ...
Please specify:
Help us improve:
remaining