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Placement accuracy: 2 µm
... Thermo Compression bonding is the key technology for current 2.5D/3D C2S and C2W packaging, with TC-CUF as the currently established process for 3D memory applications. The Datacon 8800 TC advanced sets the new benchmark based on the proven 8800 concept ...
BE Semiconductor Industries N.V.
Placement accuracy: 10 µm
... The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 12” ...
BE Semiconductor Industries N.V.
Placement accuracy: 7 µm
... 14), 5 eject tools •Stamping tools and calibration tools possible • Die attach, flip chip and multi-chip in one machine • Die pick from: wafer, waffle pack, Gel-Pak®, feeder • Die ...
BE Semiconductor Industries N.V.
Placement accuracy: 7 µm
... Bad mark search •Pre-defined fiducial geometry & customized teaching • Die Attach and Multi-Chip in one machine • Die pick from: wafer, waffle pack, Gel-Pak®, feeder • Die place ...
BE Semiconductor Industries N.V.
Placement accuracy: 3 µm
... production The new Datacon 2200 evo advanced is the latest edition in the well- established and field proven Multi Module Attach platform of Besi.With an all new gantry & controller system as well as a completely new vision and camera ...
BE Semiconductor Industries N.V.
Placement accuracy: 10, 12, 18, 20 µm
... The Esec 2100 hS ix is the latest member of the 2100 i Die Bonder family. It is optimized for highest speed and scratch-free transport thanks to the easy-to-use motorized and programmable rail strip handler. The Esec ...
BE Semiconductor Industries N.V.
Placement accuracy: 20 µm
... The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications such as QFN, ...
BE Semiconductor Industries N.V.
Placement accuracy: 35, 50 µm
... The Esec 2100 SSI is the latest addition to the proven Esec 2100 12-inch die bonder family, integrating the innovative Phi-Y Pick & Place concept with a new Soft Solder Indexer. This flexible indexer accommodates a wide ...
BE Semiconductor Industries N.V.
... new Esec Die Bonder 2009 SSIE is engineered to meet all upcoming challenges in power die attach. Its unprecedented productivity and process control are unmatched in the industry. Thanks ...
BE Semiconductor Industries N.V.
Placement accuracy: 80 µm
... The Esec 2009 fSE is the fastest soft solder die bonder in the industry with a broad application range. First to mention the point-to-line pick & place with stationary indexer, which enables increased throughput and productivity. Key ...
BE Semiconductor Industries N.V.
Placement accuracy: 2 µm
... Automatic Multi-Purpose Bonder The automated FINEPLACER® femto pro embodies the essence of the successful FINEPLACER® femto die bonder platform, offering high precision and versatility with a focus ...
Placement accuracy: 0 µm - 12.5 µm
... LQ-DA1201 is a high-speed, high-precision die bonder for IC packaging designed for solid-state mounting processes. The machine supports silver paste placement and the DAF process, accepts LF and substrate feed, and its ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 5 µm - 5 µm
The LQ-FC200US is a hot-press ultrasonic flip-chip mounting system designed for high-throughput, high-precision solid-state mounting and multi-process bonding. It features an operator-friendly large color touch panel with dialog-style software and supports ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 7 µm
... H3-DB10A is a high-precision automatic silver-adhesive placement system developed for advanced packaging processes, intended for COB R&D verification and mass production. The unit features a modular architecture and supports automatic dispensing, automatic ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 1 µm - 5 µm
... Overview
HP-EB1000FC is a fully automatic, high-precision eutectic placement system that supports both eutectic and silver-adhesive placement processes. It is designed for COC and COS eutectic workflows and features an automatic tool change ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 0 µm - 12.5 µm
... HS-EB6000 is a fully automatic inline eutectic die bonder designed for high-precision soldering processes and mass production of high-power LEDs and power devices. The system delivers oxygen-free bonding and reduced thermal ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
... The iStack™ S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. Its enhanced process features include the face-down process, In-Situ ...
Kulicke & Soffa
... With an emerging trend in attaching thinner die and substrates, the iStack™ W+ offers a solution for wafer level die attach. Features & Options High Accuracy kit (5 μm) Mapping Functions (Substrate ...
Kulicke & Soffa
... Assembly Applications: PLATFORM FOR DIE ASSEMBLY AND SMALL SMD PLACEMENT Lab and Prototype (Lab, Jewelry, Watches, smd, BGA,..) Small parts handling capability Solder paste SMD Reflow Eutectic die bonding High ...
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