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{{/each}}
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{{/end}}
{{/each}}
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... Product overview
The INFINITE is a next-generation 12” automatic
die
bonder designed for high-precision placement and stable dispensing. It integrates dedicated technologies for epoxy control, level sensing, ...
ASM Assembly Systems
Placement accuracy: 2 µm
... Thermo Compression bonding is the key technology for current 2.5D/3D C2S and C2W packaging, with TC-CUF as the currently established process for 3D memory applications. The Datacon 8800 TC advanced sets the new benchmark based on the proven 8800 concept ...
BE Semiconductor Industries N.V.
Placement accuracy: 0 µm - 12.5 µm
... LQ-DA1201 is a high-speed, high-precision die bonder for IC packaging designed for solid-state mounting processes. The machine supports silver paste placement and the DAF process, accepts LF and substrate feed, and its ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 5 µm - 5 µm
The LQ-FC200US is a hot-press ultrasonic flip-chip mounting system designed for high-throughput, high-precision solid-state mounting and multi-process bonding. It features an operator-friendly large color touch panel with dialog-style software and supports ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 7 µm
... H3-DB10A is a high-precision automatic silver-adhesive placement system developed for advanced packaging processes, intended for COB R&D verification and mass production. The unit features a modular architecture and supports automatic dispensing, automatic ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
... The iStack™ S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. Its enhanced process features include the face-down process, In-Situ ...
Kulicke & Soffa
Placement accuracy: 2 µm
... Automatic Multi-Purpose Bonder The automated FINEPLACER® femto pro embodies the essence of the successful FINEPLACER® femto die bonder platform, offering high precision and versatility with a focus ...
... Assembly Applications: PLATFORM FOR DIE ASSEMBLY AND SMALL SMD PLACEMENT Lab and Prototype (Lab, Jewelry, Watches, smd, BGA,..) Small parts handling capability Solder paste SMD Reflow Eutectic die bonding High ...
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