Die-attach die bonder Esec 2009 SSIE

fully-automaticfor the semiconductor industryhigh-accuracy

The new Esec Die Bonder 2009 SSIE is engineered to meet all upcoming challenges in power die attach. Its unprecedented productivity and process control are unmatched in the industry. Thanks to the patented soft solder process technologies the Esec Die Bonder 2009 SSIE ensures your leading market position. The 2009 SSIE is the only softsolder bonder in the market able to handle 300mm / 12" wafers (optional). Key Features Highest Speed • New point to line pick & place • High speed high accuracy dispensing technology Best Process Quality • Lowest gas consumption • Patented dispensing and bonding technology • Process visualization Widest Application Range • Solution to handle the ultra thin and ultra wide leadframes • Solution to process power modules Fastest Time to Yield • Fast product change over with exchangeable indexer • User friendly menu structure • Easy to use mechanical design Co-Development • Involve in power package design • Work closely together with customers and suppliers Ready for the Future • Expandable machine design • Multi process capability • Ultra thin die handling