Die-attach die bonder Esec 2100 SSI

fully-automaticfor the semiconductor industryhigh-accuracy

The Esec 2100 SSI is the latest addition to the proven Esec 2100 12-inch die bonder family, integrating the innovative Phi-Y Pick & Place concept with a new Soft Solder Indexer. This flexible indexer accommodates a wide range of leadframes, while the advanced Dispensing and Pre-pressing System delivers optimal performance for processing Soft Solder in today’s demanding High-Power Packages. With a high-force, closed-loop 300N option, this platform stands out as the most versatile and capable die bonder for Diffusion Soldering and Direct Sintering on various leadframes. Its exceptional process control and productivity set a new industry standard. Besi’s patented Soft Solder Process Technologies, combined with the Esec 2100 SSI, help maintain a competitive edge in the market. Demonstrations and sample builds with your material can be done on a live machine in one of our labs. We are happy to invite you for a visit. Contact us today for more information. Key Features Leading Edge Machine Concept Dedicated Real-time OS for tight process control High performance P&P and Dispensing Technology Constant status control with real-time wafer, strip and magazine viewers Real-time process monitoring through live images of the Pick and Bond process zone Best Process Quality Lowest gas consumption Patented dispensing and bonding technology. Closed-loop bond force control and auto force referencing (300N option). Process visualization and display of bond force curve during process setup (300N option).