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... optionally 14), 5 eject tools Stamping tools and calibration tools possible Die attach, flip chip and multi-chip in one machine Die pick from: wafer, waffle pack, Gel-Pak®, feeder Die ...
BE Semiconductor Industries N.V.
... Pre-defined fiducial geometry & customized teaching Pick & Place Head - Die Attach, Flip Chip and Multi-Chip in one machine - Die pick from: wafer, waffle pack, Gel-Pak®, feeder - Die ...
BE Semiconductor Industries N.V.
... down-time prevention caused by flux • Trajectory controlled heating and cooling • New thermal stress resistant tool holder - Tilt • Accurate temperature calibration station Optimized ...
BE Semiconductor Industries N.V.
The BL100 is a table-top die bonder. It comes in a compact design with a footprint not much larger than a typewriter. It can be operated by seating personnel for best performance of the manual tasks within ...
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