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Placement accuracy: 1 µm
... li>
Key Features
- High‑precision die
ASM Assembly Systems
Placement accuracy: 0 µm - 1.5 µm
... Overview
ASMPT AMICRA CoS is a purpose-built multi-
die
bonder for Chip-on-Submount applications. It performs high-precision multi-
die placement on singulated submounts using eutectic bonding ...
ASM Assembly Systems
Placement accuracy: 7 µm
... µm @ 3σ*
- Optional smart heating system with anti-baking thermal management
- Accurate
ASM Assembly Systems
Placement accuracy: 2 µm
... down-time prevention caused by flux • Trajectory controlled heating and cooling • New thermal stress resistant tool holder - Tilt • Accurate temperature calibration station Optimized Tool Holder & ...
BE Semiconductor Industries N.V.
Placement accuracy: 7 µm
... 14), 5 eject tools •Stamping tools and calibration tools possible • Die attach, flip chip and multi-chip in one machine • Die pick from: wafer, waffle pack, Gel-Pak®, feeder • Die place to: substrate, ...
BE Semiconductor Industries N.V.
Placement accuracy: 7 µm
... Bad mark search •Pre-defined fiducial geometry & customized teaching • Die Attach and Multi-Chip in one machine • Die pick from: wafer, waffle pack, Gel-Pak®, feeder • Die place to: substrate, boat, ...
BE Semiconductor Industries N.V.
Placement accuracy: 5 µm - 5 µm
... Typical product examples: SAW devices, TCXO, LEDs, MEMS, power devices
Placement accuracy: 1 µm - 5 µm
... dependent)
Placement accuracy: 0 µm - 12.5 µm
... inline eutectic die bonder designed for high-precision soldering processes and mass production of high-power LEDs and power devices. The system delivers oxygen-free bonding and reduced thermal shock ...
... The BL100 is a table-top die bonder. It comes in a compact design with a footprint not much larger than a typewriter. It can be operated by seating personnel for best performance of the manual tasks within the bonding ...
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