Eutectic die bonder HS-EB6000

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HS-EB6000 is a fully automatic inline eutectic die bonder designed for high-precision soldering processes and mass production of high-power LEDs and power devices. The system delivers oxygen-free bonding and reduced thermal shock risk through multi-zone temperature control and nitrogen purging.

Key functions and features:

• Independently controlled rotary pick-up axis with nozzle heating to enhance pick-and-place stability.
• Multi-zone design with preheat, soak and cooling zones to prevent thermal shock and optimize soldering profiles.
• Nitrogen-purged bonding area to enable oxygen-free eutectic bonding and reduce atmospheric effects.
• Compatible with multiple feed formats and substrate sizes; supports 2" GEL-PAK and 6" wafer ring; optional automatic feeding.
• Suitable for optoelectronics, power device assembly, RF/microwave components and new energy vehicle power electronics production.

Specifications / Technical data:

• Model: HS-EB6000
• Placement accuracy: ±12.5 µm @ 3σ; Rotational placement accuracy: ±0.1° @ 3σ
• Bonding force: programmable, 30 g – 250 g
• Heating capability: from room temperature up to 320 °C; Temperature uniformity < 5 °C; Temperature stability ±1 °C
• Temperature zones: preheat zone, soak zone, cooling zone; supports constant-temperature heating and nozzle heating
• Protection & safety: nitrogen purging of the bonding area to reduce atmospheric influence; multiple recovery points for reductive/flammable gases to ensure safe production
• Carriers & substrates: tray capacity 20 pcs; substrate size customizable (length 90–115 mm, width 45–75 mm)
• Throughput: UPH up to 5,000