Wafer automatic placer LQ-EB10A

Overview
LQ-EB10A is a fully automatic eutectic placement equipment designed for eutectic placement in COC and BOX deep cavity applications. It features a fully automatic loading/unloading transfer system, multiple pick-up heads and a force-controlled mounting head operation system and can be customized for specific user application solutions.

Key features

• Automatic loading and unloading transfer system
• Multiple pick-up heads for high throughput
• Highly stable force-controlled mounting head operation system
• Supports front/back reference mounting methods
• Designed for COC and BOX deep cavity eutectic processes
• Suitable for mass production and R&D testing

Application areas

• Photonics
• Power devices
• Microwave RF device field
• New energy vehicle sector

Additional product points

• Input and output transfer capability
• High stability and automatic calibration
• Calibration functions for positional accuracy
• Integrated self-developed soldering station (heating up to 400°C)
• Hub/network equipment with two mounting mode switching and automatic positional calibration
• Feedstock support: 2" GEL-PAK, 2" WAFFLE-PAK, 6" wafer ring

Technical specifications

• Mounting method: Front/Back Reference Mount
• Mounting process: Eutectic Mounting
• Application scenarios: COC; BOX Deep Cavity
• Mounting accuracy (typical): ±5 μm / ±0.5° (standard film); ±10 μm / ±1° (application dependent)
• Equipment efficiency: ≈10 S/PCS (application dependent; eutectic time excluded)
• Bonding accuracy: ±10 μm @ 3σ placement accuracy; ±0.5° @ 3σ placement rotation accuracy
• Soldering station: self-developed, up to 400°C heating