Eutectic die bonder HP-EB3300

automatedfor wafersfor research and development

The eutectic surface mounter HP-EB3300 is an automated eutectic mounting system designed for precise front/back reference placement and eutectic bonding processes (dipping, dispensing). It targets demanding sectors such as photonics, power devices, microwave RF and new energy vehicles, suitable for both R&D and industrial volume production.

Key attributes

• Automated operation
• Precision placement (±1 μm on standard substrates)
• High flexibility for R&D and volume production
• Automatic pick-up tool change system

Application area

• Photonics
• Power devices
• Microwave RF devices
• New energy vehicle sector

Mounting / process

• Front/Back reference placement — mounting method
• Eutectic mounting (dipping, dispensing) — bonding process
• Applicable scenarios: COC; COS

Advantages / functional modules

• Dual heating welding station: temperature control from room temperature to 400 ℃; heating rate ≤ 100 ℃/s
• Dispensing & dipping: glue-dipping mode with self-calibrating tip
• Feedstock compatibility: 2" GEL-PAK, 2" WAFFLE-PAK, 6" wafer ring, 8" wafer ring

Technical specifications

• Model: HP-EB3300
• Mounting accuracy: ±1 μm (standard substrates); ±3 μm (application dependent)
• Bonding accuracy: ±3 μm @ 3σ placement accuracy
• Placement rotation accuracy: ±0.1° @ 3σ
• Equipment throughput: approximately 20–25 s/pcs (application dependent)