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Placement accuracy: 3 µm - 3 µm
... mixed-device runs while maximizing uptime.
Finetech
Placement accuracy: 0.3 µm
... Automated Prototype2Production Bonder The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications ...
Finetech
Placement accuracy: 2 µm
... Automatic Multi-Purpose Bonder The automated FINEPLACER® femto pro embodies the essence of the successful FINEPLACER® femto die bonder platform, offering high precision and versatility with a focus ...
Finetech
Placement accuracy: 3 µm
... Multi-Purpose Manual Die Bonder The FINEPLACER® pico 2 is a versatile manual die bonder with placement accuracy down to 3 µm. Quick to set up and easy to operate, it is ideal for ...
Finetech
Placement accuracy: 0.5 µm
... table top flip chip bonder FINEPLACER® lambda 2 builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more. The completely revised ...
Finetech
Placement accuracy: 0.5 µm
... Semi-automated Sub-Micron Bonder The FINEPLACER® sigma combines sub-micron placement accuracy with a 450 x 150 mm working area and bonding forces up to 1000 N. The system is ideal for all types of precision die bonding ...
Finetech
Placement accuracy: 3 µm
... Production Die Bonder The all new FineXT 6003 is a fully automatic large area production die bonder with true multi-chip, multi placement capability for high volume manufacturing. The ...
Finetech
Placement accuracy: 0 µm - 12.5 µm
... HS-EB6000 is a fully automatic inline eutectic die bonder designed for high-precision soldering processes and mass production of high-power LEDs and power devices. The system delivers oxygen-free bonding and reduced thermal ...
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