Automated die bonder FINEPLACER® pico ma

high-accuracy

Multi-purpose Die Bonder The FINEPLACER® pico ma is our most cost effective bonder designed for prototyping or low-volume production, R&D labs and universities. This versatile platform is used in a wide range of micro assembly applications – such as flip chip bonding, die attach and components requiring a novel bonding approach. Highlights - Placement accuracy 5 µm - Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm - Working area up to 450 mm x 234 mm - Supports wafer/substrate sizes up to 200 mm - Supports bonding forces up to 700 N - Can be configured as a hot air rework system - Manual and semi-automatic configurations